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Peters ELPEPCB® Printed Circuit Coatings

Peters Conformal Coatings

PRODUCTS & SERVICE: ELPEPCB® PRINTED CIRCUIT COATINGS

The complete range of printed circuit coatings which fulfill highest demands in pcb manufacturing.

ELPEPCB® Etch resists, plating resists and Elpemer® photoresists

For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness.

Elpemer® photoresists: Excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution.

Thermal curing etch and plating resists: High-definition application by screen printing

UV curing etch and plating resists: High-definition application by screen printing, alkaline-strippable

ELPEPCB® Solder resists

Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion.

Photoimageable Elpemer® solder resists: Excellent resolution, capable of representing finest structures (ink dams), for all standard application processes, UL approvals in acc. with UL File No. E80315.

Thermal curing solder resists: High-definition application by screen printing, UL approvals in acc. with UL File No. E80315

UV curing solder resists: High-definition application by screen printing, for "print and etch", UL approvals in acc. with UL File No. E80315

ELPEPCB® Peelable solder masks

For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process.

ELPEPCB® Via hole fillers

Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing

ELPEPCB® Plugging pastes

Bubble-free, smooth hole plugs/insulation layers in HDI/SBU technology, application by screen and stencil printing and vacuum screen printing, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315

ELPEPCB® Marking inks

Exceptional covering power, very good adhesion, soldering resistant, high solids content.

Photoimageable Elpemer® marking inks: Blanket application by screen printing, especially suitable for pilot and low-volume series' as no complex screen stencil required, capable of representing finest details

Thermal curing marking inks: High-definition application by screen printing

UV curing marking inks: High-definition application by screen printing

ELPEPCB® Carbon-conductive inks

To substitute gold on contact points or to conduct static charge

Carbon-conductive inks: High-definition application by screen printing, to substitute gold, also suitable for cross-over technology and for generating printed resistors, very good adhesion to flexible base material, thus also suitable for "static flex" applications, excellent mechanical resistance, resistant to Hot-Air Levelling

Conductive lacquer: Prevents static build-up and conducts static charge away, for coating the insides of casings and packagings designed to protect highly sensitive electronic components from static electricity

ELPEPCB® Thick film fillers

Fill insulation channels in thick copper technology (e.g. 400 µm technology) by means of screen or stencil printing, solvent-free, very good soldering resistance also in lead-free soldering processes.

ELPEPCB® Thermal transfer pastes

Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating.

Heatsink pastes

Thermal itnerface paste

ELPEPCB® Touch-up coatings / repair coatings

Remove minor mechanically caused damages to the ink surface, e.g. scratches in solder mask.

Auxiliary products for circuit printing

Universal thinners / universal retarders

Screen openers

Anti-static sprays / anti-static agents

Special strippers

Cleaning agents: For cleaning work tools, screens and processing equipment and for use in automatic screen washers

Defoamants

Solder flux lacquers

ELPEPCB® Etch resists, plating resists and Elpemer® photoresists

Elpemer® photoresists

 RC 2054 HR series

  • Etch resist
  • Application by roller coating, curtain coating, dip coating
  • Marked colour change during exposure enables good visual inspection
  • Colors: Blue-Violet

SD 2054

  • Etch and plating resist
  • Application by screen printing
  • Colors: Blue

Thermal curing etch and plating resists

SD 2052 AL series

  • Etch resist
  • Resistant to pH 9
  • Alkaline-strippable
  • Colors: Black, Blue

SD 2149 SIT-HS

  • Plating resist for use in Secondary Imaging Technology (SIT), protects metal surfaces during electroless Ni/Au process (ENiG), thus enabling an additional surface finish
  • Good adhesion to copper and solder resists
  • Alkaline- or solvent-strippable
  • Colors: Black

SD 2154 E

  • Elastic etch and plating resist also suitable for air drying
  • Outstanding resistance over the whole pH range, also in cyanidic baths
  • Solvent-strippable
  • Colors: Blue

UV curing etch and plating resists

SD 2050 UV

  • Etch and plating resist, resistant to pH 9
  • Capable of representing 150 µm structures
  • Suitable to etch 400 μm thick copper
  • Colors: Blue

SD 2058 UV-FS

  • Etch resist, resistant to acid baths
  • Capable of representing 150 µm structures
  • Strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution
  • Colors: Blue

SD 2059 UV-AL-T

  • Etch and plating resist, resistant to pH 9
  • Capable of representing 150 µm structures
  • Colors: Blue

SD 2150 UV-AL-FS

  • Etch and plating resist, resistant to acid baths
  • Capable of representing 250 µm structures
  • For flexible circuits and roll-to-roll application
  • Strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution
  • Colors: Blue

ELPEPCB® Solder resists

Photoimageable Elpemer® solder resists

SD 2463 FLEX-HF series

  • Application by screen printing, for printing on flexible base materials, aqueous-alkaline developable
  • Excellent resolution down to 30 μm
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Fulfil/exceed IPC-SM-840E
  • Colors: Black, White, Green, Amber

2467 series

  • For all standard application processes, aqueous-alkaline developable
  • Outstanding thermo-mechanical properties with respect to thermal cycling resistance and permanent/high-temperature resistance
  • Fulfil/exceed amongst others IPC-SM-840E, NASA outgassing test in acc. with ASTM E595; resistant to mould and noxious gases
  • Halogen-free adjustments in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • LDI versions for direct imaging
  • Colors: Colorless, Black, White, Blue, Yellow, Red, Dark-Green, Grass-Green, Yellow-Green, Extra Dark-Green

2469 SM-HF series

  • For all standard application processes, extremely wide processing window, developable in carbitol or butyl carbitol
  • Outstanding thermo-mechanical properties with respect to thermal cycling resistance and permanent/high-temperature resistance
  • Fulfil/exceed amongst others IPC-SM-840E, resistant to mould and noxious gases
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Colors: Green

2491 TSW series

  • For all standard application processes, aqueous-alkaline developable
  • Very resistant to yellowing, even after lead-free reflow soldering processes and high thermal load, low ΔE values, in particular Δb values
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Cracking resistant in thermal shock test (TCT -40 to +125 °C)
  • Colors: White

Thermal curing solder resists

SD 2444 NB-M

  • Excellent resistance to soldering processes

SD 2446 / SD 2496 TSW

  • Very good weathering and chalking resistance (QUV accelerated weathering test)
  • Excellent colour resistance, even after lead-free reflow soldering and tempering processes, low ΔE values
  • SD 2496 TSW: High reflectivity and exceptional yellowing resistance
  • Halogen-free in acc. with JPCA-ES01-2003/IEC 61249-2-21
  • Colors: Black, White

SD 2462 NB / SD 2462 NB-M series

  • Excellent definition and superior conductor edge (knee) coverage
  • SD 2462 NB-M is especially suitable as a "top coat" for thick copper technology (e.g. 400 µm technology, see also thick film fillers)
  • Excellent chemical resistance
  • Colors: Black, Green, Blue

UV curing solder resists

SD 2368 UV series

  • Cure thoroughly even in thicker layers
  • Suitable for Hot-Air Levelling
  • SD 2348 UV-SM is halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Colors: Black, Green, Dark-Green

SD 2460/201 UV-FLEX series

  • Resistant to HAL and lead-free reflow soldering
  • For flexible circuits, excellent adhesion to polyimide, polycarbonate and polyester foils
  • For cross-over technology
  • Halogen-free in acc. with JPCA-ES01-2003 and IEC 61249-2-21 (except SD 2460/201 UV-FLEX)
  • Colors: Black, White, Green, Blue, Red, Amber

ELPEPCB® Peelable solder masks

SD 2950 series

  • For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
  • For printing over carbon-conductive ink
  • Peelable from plated-through holes
  • Suitable as masks in electroplating and other metallisation processes
  • Unlimited pot/processing life, solvent-free
  • Colors: White, Blue, Blue-Green

ELPEPCB® Via hole fillers

SD 2361 series

  • 100% solids content means virtually no volume shrinkage
  • 1-pack system
  • Thixotropic adjustment for larger drill holes (approx. 0.5-1 mm)
  • Colors: Green

Elpemer® VF 2467 DG

  • Photoimageable 2-pack via hole filler
  • Basically compatible with Elpemer® 2467 solder resist series
  • Aqueous-alkaline developable
  • Colors: Dark-Green

SD 2768 NB

  • High solids content means low volume shrinkage
  • For via-in-pad applications, no bleeding on gold or other metal surfaces
  • Colors: Green

Elpemer® VF 2469 SM-HF

  • Photoimageable 2-pack via hole filler
  • Basically compatible with the Elpemer® 2469 SM-HF solder resist series
  • Developable in carbitol or butyl carbitol
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • Colors: Green

ELPEPCB® Plugging pastes

PP 2793 series

  • Very low coefficient of thermal expansion (CTE) and high glass transition temperature (Tg) of 155 °C
  • Excellent resistance in more aggressive desmear processes
  • Tested in acc. with ASTM E595 (NASA-approved outgassing test)
  • Long shelf life: 4 months
  • Colors: Grey

PP 2795 series

  • Application also by roller coating
  • Higher aspect ratios possible with high-viscosity adjustment
  • Green version for a more visually uniform appearance if no metallisation is applied
  • Listed in NASA specification D-8202
  • Long shelf life: up to 6 months
  • Colors: White, Green, Light-Grey

ELPEPCB® Marking inks

Photoimageable Elpemer® marking inks

SD 2691 TSW

  • Aqueous-alkaline developable
  • Outstanding yellowing resistance even after reflow soldering and tempering processes, low ΔE values
  • Colors: White

SD 2618 / SD 2698

  • Aqueous-alkaline developable
  • Colors: White, Yellow

Thermal curing marking inks

SD 2597

  • 1-pack ink with long screen opening time
  • excellent definition
  • very good adhesion on copper, FR4 base material and solder resists
  • Colors: White

SD 2696 TSW

  • Excellent yellowing resistance after lead-free reflow soldering and tempering processes, low ΔE values
  • High reflectivity
  • Very good weathering and chalking resistance (QUV accelerated weathering test)
  • Colors: White

SD 2692 T series

  • Long pot/processing life: at least 6 weeks
  • Catalysed adjustments cure faster, pot life 1 day
  • Superior chemical resistance
  • Colors: Black, White, Blue, Yellow, Red

SD 2617 series

  • Long pot/processing life: at least 1 month
  • Colors: Yellow

UV curing marking inks

SD 2513 UV series

  • Solids content 100%
  • Short curing times
  • High colour stability
  • Colors: Black, White, Yellow

ELPEPCB® Carbon-conductive inks

Carbon-conductive inks

SD 2842 HAL
  • Ultra-smooth surface, thus also suitable for sliding contacts
  • Colors: Black

SD 2843 HAL

  • For touch-key contacts
  • Individual resistances possible by mixing with insulating paste SD 2803 HAL
  • Colors: Black

Conductive lacquer

EH 13.344
  • Application by brushing or spraying
  • Drys at room temperature
  • Colors: Black

ELPEPCB® Thick film fillers

DSF 2706 UV

  • UV curing 2-pack system
  • UL approval in acc. with UL 94, UL File No. E80315
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • For use on outer layers
  • System component in thick copper technology in combination with the 2-pack solder resist SD 2462 NB-M as "top coat"
  • Colors: Colorless

DSF 2793

  • Thermal curing 1-pack system
  • For the generation of thick-copper inner layers
  • Corresponds to the best flame class V-0 in acc. with UL 94
  • Colors: Light-Grey

ELPEPCB® Thermal transfer pastes

Heatsink pastes

HSP 2740 / HSP 2741

  • 1-pack systems with 100% solids content
  • HSP 2740: Excellent printing properties, silk-mat surface and better chemical resistance
  • HSP 2741: Higher flexibility, thus less impact on the evenness of the pcb; UL approval in acc. with UL File No. E80315
  • Colors: Black

Thermal interface paste

TIP 2792

  • 1-pack system with 100% solids content
  • is applied as Thermal Interface Material (TIM) between the printed circuit board and the heatsink or heat-dissipating casings for a reliable thermal connection
  • for thermo-mechanical decoupling
  • Colors: White

ELPEPCB® Touch-up coatings / repair coatings

Touch-up lacquer SD 2369 UV-ABL

  • Application by screen printing or brush
  • Yellow-green 1-pack coating
  • UV curing
  • Colors: Yellow-Green

Repair coating EH 13.767

  • Application by brush
  • Green opaque, mat 1-pack coating
  • Dries at room temperature, beneficial for the repair of pcb assemblies after completed soldering as they often must not be exposed to further thermal stress
  • Colors: Green

Auxiliary products for circuit printing

Universal thinners / universal retarders

UV 5000 / UZ 5100

  • For many 1- and 2-pack screen printing inks provided no other dedicated thinner or retarder is prescribed
  • UV 5000 reduces the viscosity
  • UZ 5100 reduces the viscosity and prolongs the screen-open time

Screen openers

HP 5200

  • Spray to dissolve dried printed circuit coatings from screens, no need for complicated washing proceses to clean screens after work breaks
  • Highly effective, fast action
  • Silicone- and grease-free, meaning no surface disruptions/dewettings or smearing during subsequent printing process

Anti-static sprays / anti-static agents

HP 5500 / HP 5501

  • Prevent and remove static build-up during the pcb printing process
  • Reduce dust-related errors during screen printing and when processing dry resists
  • Highly effective, simple and safe to use
  • HP 5500 - in a practical spray can
  • HP 5501 for application by spraying, dipping or with a brush or cloth

Special strippers

HP 5707

  • Suitable for removing exposed and potentially cured photoimageable solder resists (e.g. after faulty exposure)
  • Suitable for cleaning coating developers and resist stripper equipment, batches of cleaner can be used multiple times

Cleaning agents

R 5899

  • For use in automatic screen washers, extremely high flash point (> 100 °C)
  • Low vapour pressure < 0.1 hPa at 20 °C, thus not a VOC (Volatile Organic Compound) per the EU directive 1999/13/EC
  • Must not be declared per German dangerous goods regulations, easily biologically degradable in acc. with OECD Test 301 A

R 5800 series

  • Fast and vigorous cleaning effect
  • R 5814/R 5817: Remove coatings from screens, tools and after faulty prints, R 5814 has a lighter odour than R 5817, R 5817 cleans quicker
  • R 5821: High flash point (+32 °C), suitable for use in automatic screen washers and for cleaning ink processing equipment

R 5851

  • for removing solder residues from assembled pcbs

Defoamants

HP 5911

  • For defoaming aqueous-alkaline developer solutions, e.g. 1% soda solution
  • Silicone-free; biologically degradable

Solder flux lacquers

SL 1232

  • Protective and preservative coating, maintains the solderability of unassembled pcbs, reliably prevents the oxidation of copper traces and at the same time is a soldering aid based on modified colophony resin 
  • Application by roller coating, dries at room temperature
  • Very good solderability from as low as 215 °C